Novel electronic interconnects for reliability under extreme thermal cycling

Electronic interconnects are essential to advanced technologies, providing mechanical and electrical connections between components in the circuitry to transmit power and signals. However, they face significant challenges under extreme temperature fluctuations in demanding environments, such as space deployment. At cryogenic temperatures, materials often become brittle, while rapid thermal cycling can induce failure, compromising system reliability. This project aims to develop robust interconnect materials with exceptional cryogenic ductility, capable of deforming without fracture under extremely temperature fluctuations. The expected outcome is a new class of interconnect materials that deliver reliable performance across a wide temperature range. These materials will offer substantial benefits enabling next-generation cryogenic technologies and enhancing system resilience in extreme thermal conditions.

You will be based at the St Lucia campus in The University of Queensland (UQ).
You will have access to a foundry for sample fabrication, a metallography laboratory, mechanical testing lab, state-of-the-art electron microscopes, X-ray characterisation facilities, synchrotron facilities, 4-point electrical and thermal conductivity measurement instrument and specialist software required for the project. The UQ library also provides access to a list of generic software and journal database.
You will have opportunities to undertake collaborative research, access test vehicle design and industry-scale equipment at partner sites in Brisbane and Japan, and visit national and international research facilities, including synchrotrons and state-of-the-art transmission electron microscopy laboratories.
Training for specialist and transferable skills relevant to the project is available. 

This project is supported by the Research project scholarship.

Learn more about the Research project scholarship.

Your application will be assessed on a competitive basis.

We take into account your:

• previous academic record
• publication record
• honours and awards
• employment history.

A working knowledge of academic research and soldering would be of benefit to someone working on this project.

You will demonstrate academic achievement in the fields of material science, metallurgy, and mechanical engineering and the potential for scholastic success.

A background or knowledge of alloy design, mechanical properties testing, X-ray diffraction, electron microscopy, and density functional theory (DFT) simulation is highly desirable.

You must submit an expression of interest (EOI) by 19 April, 2026 19 April, 2026.

Before you apply

1. Check your eligibility for the Doctor of Philosophy (PhD).
2. Prepare your documentation.
3. If you have any questions about whether the project is suitable for your research interests, contact Dr Xin Fu Tan (xin.tan@uq.edu.au).

When you apply

To apply, submit an expression of interest (EOI) for the program. You don't need to apply separately for the project or scholarship. How to submit an EOI

In your EOI, complete the ‘Scholarship/Sponsorship’ section with the following details:

1. Are you applying for an advertised project: 'Yes'
2. Project: 'Research project scholarship'
3. Scholarship Code Listed in the Advertisement: THERMAL-TAN
4. Link to Scholarship Advertisement: https://study.uq.edu.au/study-options/phd-mphil-professional-doctorate/projects/novel-electronic-interconnects-reliability-under-extreme-thermal-cycling

Submit an EOI